Charged EVs | Microchip’s BZPACK mSiC power modules target harsh environments with >1,000-hour HV-H3TRB performance

Microchip Technology has introduced its BZPACK mSiC power modules, a new silicon carbide module family aimed at industrial and renewable-energy systems that have to survive heat, humidity, and high voltage over long operating lives.

The key selling point is environmental robustness. Microchip says the modules are tested to meet High Humidity High Voltage High Temperature Reverse Bias (HV-H3TRB) requirements beyond the standard 1,000-hour threshold. The company also points to a CTI 600 case rating, stable Rds(on) across temperature, and substrate options in aluminum oxide or aluminum nitride for insulation and thermal management.

The BZPACK family is available in half-bridge, full-bridge, three-phase, and PIM/CIB topologies. Microchip says the modules use its MB and MC SiC MOSFET families and are designed with a compact baseplate-less structure, Press-Fit solderless terminals, and optional pre-applied thermal interface material to simplify assembly and improve manufacturing consistency. The company also says the modules use industry-standard footprints and are pin-compatible to make multisourcing easier.

MC-family devices also integrate a gate resistor for improved switching control and stability in multi-die module configurations, while some devices in the broader mSiC portfolio are available with AEC-Q101 qualification.

“By leveraging our advanced mSiC technology, we’re giving customers a simpler path to building efficient, long-lasting systems across industrial and sustainability markets,” said Clayton Pillion, vice president of Microchip’s high-power solutions business unit.

Source: Microchip